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1. Æ÷Å丮¼Ò±×·¡ÇÇ(Photolithography)

¥¡) Æ÷Å丮¼Ò±×·¡ÇÇ(Photolithography)¶õ?
Photolithography °øÁ¤Àº ¾î¶² ƯÁ¤ÇÑ È­Çоàǰ(Photo resist)ÀÌ ºûÀ» ¹ÞÀ¸¸é È­ÇйÝÀÀÀ» ÀÏÀ¸ÄѼ­ ¼ºÁúÀÌ º¯ÇÏ´Â ¿ù¸®¸¦ ÀÌ¿ëÇÏ¿©, ¾ò°íÀÚ ÇÏ´Â pattenÀÇ mask¸¦ »ç¿ëÇÏ¿© ºûÀ» ¼±ÅÃÀûÀ¸·Î PR¿¡ Á¶»çÇÔÀ¸·Î½á mask patten°ú µ¿ÀÏÇÑ pattenÀ» Çü¼º½ÃŰ´Â °øÁ¤ÀÌ´Ù. Photolithography °øÁ¤Àº ÀϹݻçÁøÀÇ film¿¡ ÇØ´çÇÏ´Â photo resist¸¦ µµÆ÷ÇÏ´Â PR µµÆ÷°øÁ¤, mask¸¦ ÀÌ¿ëÇÏ¿© ¼±ÅÃÀûÀ¸·Î ºûÀ» Á¶»çÇÏ´Â ³ë±¤°øÁ¤, ´ÙÀ½¿¡ Çö»ó¾×À» ÀÌ¿ëÇÏ¿© ºûÀ» ¹ÞÀº ºÎºÐÀÇ PRÀ» Á¦°ÅÇÏ¿© pattenÀ» Çü¼º½ÃŰ´Â Çö»ó°øÁ¤À¸·Î ±¸¼ºµÈ´Ù.
Photolithography °øÁ¤Àº ¸ðµç °øÁ¤ stepÀÌ °¢Á¾ particle¿¡ ´ëÇØ ¸Å¿ì Ãë¾àÇϰí, ÀÌ·Î ÀÎÇÑ pattern ºÒ·®ÀÌ Àüü panelÀÇ ºÒ·®À» À¯¹ßÇϹǷÎ, ûÁ¤ÇÑ È¯°æ°ú Àç·á ¹× ÀåºñÀÇ °ü¸®°¡ º¸´Ù Áß¿äÇÑ °øÁ¤À̸ç, ÇâÈÄ TFT Á¦ÀÛ°øÁ¤ÀÇ °íÁ¤¹Ð, ´ë¸éÀûÈ­¿¡ µû¶ó¼­ ±× Á߿伺ÀÌ ´õ¿í Ä¿Áö´Â °øÁ¤ÀÌ´Ù.
¥¢) Æ÷Å丮¼Ò±×·¡ÇÇ(Photolithography) °øÁ¤ °úÁ¤

a) Photoresist(PR) coating

? Wafer Ç¥¸é¿¡ PRµµÆ÷
¡Ø µµÆ÷¹æ½Ä
-¡¦(»ý·«)

b) Type of Photoresist(PR)

c) Soft Bake

d) Hard Bake

e) Characteristic of PR

f) Nrgative PR

g) Polymerization of Negative PR

h) Positive PR

I) Comparison of Negative and Positive PR

j) Development

k) Etching Process

l) Classification of Etching

m) Wet Etching

n) Dry Etching

o) Removal of PR




📝 Regist Info
I D : leew*****
Date : 2013-02-23
FileNo : 11056051

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